Nanoveu’s EMASS Partners with Arrow Electronics to Fast-Track Edge AI Rollout

Nanoveu (ASX:NVU) has announced a strategic collaboration between its wholly owned subsidiary EMASS and global technology heavyweight Arrow Electronics. The partnership aims to accelerate the deployment of EMASS’s ultra low power edge AI chip, the ECS DoT system on chip, across a wide range of next generation smart devices.

At the centre of this alliance is the integration of Arrow’s global engineering, supply chain, and design for manufacture capabilities with EMASS’s silicon platform. Together, the two companies are launching a joint evaluation board, to be showcased at Singapore Week of Innovation and Technology (SWITCH) from 29 to 31 October 2025. The board will provide developers with a fast-track pathway from prototype to production, enabling real time, always on inference with milliwatt class power consumption.

The ECS DoT chip is designed for use in wearables, industrial Internet of Things, smart sensing and drones. These are segments where low power requirements, space constraints, and reduced reliance on cloud connectivity are critical for commercial deployment.

Mark Goranson, Chief Executive of Nanoveu’s Semiconductor Division, said the collaboration would significantly expand the company’s global reach. “Progressing our relationship with Arrow brings ECS DoT to a much broader community of developers and manufacturers. Arrow’s global footprint, engineering depth and supply chain strength complement our technology and shorten the path from idea to shippable product.”

The partnership is focused on providing a comprehensive development environment, including enhanced software development kits, reference designs, and integrated APIs. The aim is to reduce the complexity of integrating always on AI functions into devices that need to operate with minimal power draw and cost overheads.

Arrow’s role includes supporting developers through its engineering teams, university innovation labs, and global design support infrastructure. For EMASS, this means faster adoption cycles and a clear commercial model from proof of concept to pilot and production.

According to Nanoveu, the ECS DoT platform has been engineered to support modular reference designs that are compatible with industry standard development workflows. The collaboration is also expected to position the chip for multi year design wins across a range of customers and applications.

While Nanoveu’s broader portfolio includes antimicrobial surface films and glasses free 3D display platforms, the EMASS business represents a deep tech frontier for the company, focusing on the intersection of edge AI, low power compute, and device scale integration.

The company has flagged that further updates will follow after the joint showcase at SWITCH, particularly as commercial engagements mature through the end of the year.

With this agreement, Nanoveu is placing a firm bet on the future of edge intelligence and positioning its silicon offering at the heart of a rapidly emerging global market.